charliezhai
| Type | Post | Author | Replies | Last updated |
|---|---|---|---|---|
| Forum topic | Analytical derivation on the stress of the adhesive layer based on beam/plate therories? | Mingji Wang | 2 | 1 year 12 weeks ago |
| Blog entry | A computational mechanics position in microelectronics industry | charliezhai | 1 | 2 years 33 weeks ago |
| Forum topic | Journal Club Theme of March 15: Impact of Chip-Package Interaction on Reliability of Copper/Low k Interconnects and Beyond | Rui Huang | 23 | 3 years 32 weeks ago |
| Blog entry | Chip-package interaction and interfacial delamination | Zhen Zhang | 9 | 4 years 51 weeks ago |
| Image | iMechanica needs a logo | Robert Paynter | 8 | 5 years 2 weeks ago |
| Image | IBM Airgap Microprocessor | Xiao Hu Liu | 11 | 5 years 3 weeks ago |
| Blog entry | Delamination in Patterned Films | Xiao Hu Liu | 18 | 5 years 8 weeks ago |
| Blog entry | Delamination of stiff islands patterned on stretchable substrates | Nanshu Lu | 28 | 5 years 8 weeks ago |
| Forum topic | Texas Instruments will extend outsourcing model. Will more people lose jobs? | Zhigang Suo | 15 | 5 years 16 weeks ago |

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