fracture mechanics, Spring 2007, ES 242r, lecture

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Lecture 18--Aspects of dynamic fracture

A very breif introduction to aspects of dynamic fracture mechanics.


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lecture 17. Introduction to Computational Ductile Fracture

An overview of several approaches to computational fracture mechanics for ductile structural metals.


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Lecture 16 Corner singularity and applications

In this lecture I'll describe a recent PhD Thesis by Zhen Zhang.


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Lecture 15 Ratcheting induced slow crack (RISC)

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Lectures 14 & 16; Matrix cracking, cracks intersecting an interface, and crack kinking

Matrix cracking in composites and the competition between penetration and deflection when a crack approaches an interface, and the competition between advance in the interface and kinking out of the interface for an interface crack.


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Lecture 13 Crack bridging

G. Bao and Z. Suo, " Remarks on crack-bridging concepts," Applied Mechanics Review. 45, 355-366 (1992).


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Lecture 11 & 12

Buckling delamination, with two slides on 1D vonKarman plates.


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Lecture 10 Debonding in layered materials

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Lecture 9 Interfacial fracture

  • Williams singularity
  • Energy release rate
  • Mode angle
  • Stress oscillation
  • Small scale contact
  • Example 1:  A small crack on the interface
  • Example 2:  Thin film debonding
  • Interfacial fracture energy
  • Four-point bend specimen
  • Double-cantilever beam
  • The use of the interfacial fracture energy

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Lecture 8 Mixed mode fracture

Dear Students of ES 242r / ENGM 940:

You may be interested in reading about the self-introductions of your fellow students

The attached notes are written mainly for myself. Most figures are missing. I'll draw these figures in class. So please take good notes in class.


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Lecture 7

Lecture 7.  Stability of large scale yielding crack growth & fracture mechanisms


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Lecture 6 Channel cracks in thin films

  • Various cracks in thin films under tensile or compressive stresses
  • Micrographs of cracks in thin films
  • A micrograph of a channel crack
  • The origin of stress in a film
  • Stress in a thin film due to mismatch in the coefficients of thermal expansion
  • Stress in film due to bending
  • Measure redisual stress using wafer curvature
  • Channel crack:  initiation vs.

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lecture 5

Lecture 5


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Lecture 3

Lecture 3


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Lecture 2--KIC

fracture specimens and KIC


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Lecture 1

The slides for lecture 1 are attached.


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