thin films

Dear iMechanicians, 

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A 1 year post Doctoral position is avalaible in France, on computational fractur mechanics. This is a join project between Univ. Paris 13 (LSPM lab), and Paris 7 (ITODYS lab).

The present postdoc subject is focused on the modeling cracking and buckling in thin films and nanostructures on stretchable substrate.

Dear colleagues,

Dear Colleagues,

I want to share with you our work on geometric instabilities in thin films, which was recently accepted in Soft Matter.

Meeting

2015 TMS Annual Meeting & Exhibition

Symposium

Advances
in Thin Films for Electronics and Photonics

Sponsorship

In this paper, the mechanical behavior of freestanding thin sputter-deposited films of Au is studied at temperatures up to 340°C using tensile testing. Films tested at elevated temperatures exhibit a significant decrease in flow stress and stiffness. Furthermore the flow stress decreases with decreasing film thickness, contravening the usual notion that “smaller is stronger”. This behavior is attributed mainly to diffusion-facilitated grain boundary sliding.

This paper has been accepted by Scripta Materialia.

The fatigue behavior of Ag films on polyethyleneterephthalate substrates was studied using electrical resistance measurements.
Scanning electron microscopy images showed two types of failure: typical fatigue failure with extrusion–intrusion pairs, and ductile
failure with local necking. Once through-thickness cracks are formed in the metal layer, cracks propagate and the resistance increases abruptly for both failure modes. The effect of adhesion on fatigue life is discussed in terms of concurrent delamination, crack initiation and propagation.

September 4-6, 2013     Frankfurt am Main, Germany

Dear Colleagues,

Dear Colleagues:

We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX.  The symposium is entitled Tribology of Thin Films and Small-Scale Structures and is part of the Mechanics of Solids, Structures and Fluids Track.

Abstract - Indentation experiments on very thin films are analyzed by employing a rigorous solution to model elastic substrate effects. Two cases are discussed: elastic indentations where film and substrate are anisotropic, and elasto-plastic indentations where significant material pile-up occurs. We demonstrate that the elastic modulus of a thin film can be accurately measured in both cases, even if there is significant elastic mismatch between film and substrate. 

This manuscript has been accepted for publication in Journal of Materials Research.  

Abstract – A data analysis procedure has been developed to estimate the contact area in an elasto-plastic indentation of a thin film bonded to a substrate. The procedure can be used to derive the elastic modulus and hardness of the film from the indentation load, displacement, and contact stiffness data at indentation depths that are a significant fraction of the film thickness. The analysis is based on Yu’s elastic solution for the contact of a rigid conical punch on a layered half-space and uses an approach similar to the Oliver-Pharr method for bulk materials.

Please note that a post-doc position on stresses and adhesion in optical multilayers is open. The position is for 2-years shared between SVI (Paris) and Phymat (Poitiers).

Link to a virus-free MS Word description of the position:

http://www.saint-gobain-recherche.com/svi/en/image_merethif_position.html

For further details and applications (cover letter, CV, statement of research interests):

Dear Esteemed Researcher,