At the 2007 ASME Applied Mechanics and Materials Conference (McMat 2007)

June 3-7, 2007, Austin, Texas

This symposium will provide a forum for the discussions of the latest advances in the cross-disciplinary field of integrated structures, including advanced interconnects for integrated circuits, microelectromechanical systems, and biomedical devices. The key idea is to forge interactions among active researchers from both academia and industries working in the areas of applied mechanics, materials science/engineering, and advanced technologies. Both fundamental research in mechanics and materials and practical applications in advanced technologies are welcome. Topics of interest include, but not limited to:

• Mechanics and materials in microelectronics: Cu/low k interconnects, chip-package interaction, and transistor strain engineering
• Mechanics of materials in macroelectronics: large-area flexible electronics, organic electronics, thin-film transistors, rollable displays
• MEMS/NEMS devices: integration and reliability
• Ferroelectric and ferromagnetic thin films: domain structures, multi-field interactions
• Integrated biological structures: biomechanics and biomaterials
• Biomedical devices: medical implants, etc.
• Novel mechanical testing and metrology for integrated small structures
• Stress-induced structural evolution and self assembly at micro/nano-scales

Deadline for abstract submission: January 10, 2007.

To submit your abstract, please go to Technical Tracks. Select Track “TK 16 Integrated Structures” and Topic 16-2 for this symposium.

This Symposium is organized by the Technical Committee on Integrated Structures (TCIS) of the ASME Applied Mechanics Division. The committee members include: Ibrahim Bekâr (Intel), Xiaohu Liu (IBM), Dureseti Chidambarrao (IBM), Teng Li (University of Maryland), Jun Lou (Rice University), Wei Lu (University of Michigan), Xi Chen (Columbia University), Xiao-Yan Gong (Medical Implant Mechanics LLC), Jun He (Intel, co-chair), Rui Huang (University of Texas, co-chair).