Stress-Induced Voiding in Interconnects
Submitted by Zhigang Suo on Sat, 2009-02-21 21:14.
Early aluminum lines had the width much larger than the thickness. They behaved like blanket films. When narrow aluminum lines were introduced, in early 1980s, with the width comparable to the thickness, voids were observed in such narrow interconnects on wafers held in ovens, or even on wafers left on shelves at room temperature. The voids may sever the interconnects.
| Attachment | Size |
|---|---|
| L11 SIV.pdf | 207.64 KB |
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