Home » blogs » Teng Li's blog

Revision of Effects of grain boundary adhesion and grain size on ductility of thin metal films on polymer substrates from Fri, 2011-01-21 17:15

The revisions let you track differences between multiple versions of a post.

Teng Li's picture
Submitted by Teng Li on Sat, 2008-06-21 02:15.

We study the effects of grain boundary adhesion and grain size on the ductility of thin metal films well bonded to polymer substrates, using finite element method. It is shown that the ductility of polymer-supported metal films increases approximately linearly as the grain boundary adhesion increases, and as the grain size decreases. A rule-of-thumb estimate of the ductility of polymer-supported metal films agrees well with the simulation results.

In press, Scripta Materialia, 2008 

DOI: 10.1016/j.scriptamat.2008.06.058


AttachmentSize
Teng Li_Scripta Mater_2008_Effects of GB adhesion and grain size on ductility of metal films on polymer substrates.pdf355.58 KB
TengLi-Pub24-SMM-2008.pdf256.49 KB
»