Buckling behavior of metal film/substrate structure under pure bending

Ying Li's picture

Many studies on the thin film/substrate structure and its failure mechanism were reported in recent years. The direct experimental results of thin film/substrate structure by scanning electron microscopy (SEM) presents an intriguing problem:there exists a buckling failure mechanism at the lateral edge of metal film under pure bending. The qualitative theoretical analysis has been done on such buckling failure of thin film/substrate structure. The experimental results and theoretical analysis are helpful to understand the extrinsic stresses or deformations that are induced by external physical effects. Accepted by Appl. Phys. Lett.

Buckling behavior of metal film-substrate structure under pure bending.pdf1.51 MB