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ASME IMECE 2012: Symposium on Quality and Reliability of Electronic/Photonic Packaging, MEMS, and NEMS

Frank W. DelRio's picture

Dear Colleagues:

 

We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX.  The symposium is entitled Quality and Reliability of Electronic/Photonic Packaging, MEMS, and NEMS and is part of the Micro- and Nano- Systems Engineering and Packaging Track.

 

The call-for-papers for the symposium is as follows:

Quality and reliability are critical performance characteristics of any systems in general.  Characterizing the fundamental failure mechanisms and developing models to predict product life is critical to the long-term reliability of these devices. This symposium focuses on the development of new and innovative engineering sciences and practices for quality control and reliability analysis and testing.  The applications are in the areas of consumer electronics, defense and military applications. Topics include, but are not limited to, reliability issues and failure analysis under thermal and power cycling, vibration, shock/drop, moisture, harsh chemical contaminants and combined loading, in:

1. Lead-Free Electronic Assemblies

2. MCM/SiP/SoP Technologies

3. 3-D Interconnects and Packaging

4. Underfill, Dielectric, and other polymer Applications in Advanced Packages

5. Embedded Actives/Passives

6. MEMS/NEMS Devices

7. Coatings

 

The deadline for submitting an abstract is February 27, 2012.  Abstracts can be submitted at the following website: http://www.asmeconferences.org/Congress2012/Login.cfm.  Please select Track 10, Topic 12.

 

Best regards,

Koneru Ramakrishna, Anveshak Technology and Knowledge Solutions

Satish Parupalli, Intel Corporation

Krishna Darbha, Microsoft Corporation

Frank DelRio, National Institute of Standards and Technology

 

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