Call for papers: Symposium on Mechanics of Soft Materials in ASME IMECE 2010

H Jerry Qi — Fri, 29 Jan 2010 01:18:29 -0500

Dear friends and colleagues,

We invite you to submit an abstract to Symposium on Mechanics of Soft Materials. This symposium is part of 2010 ASME International Mechanical Engineering Congress & Exposition, November 12-18, 2010 Vancouver, British Columbia, Canada. This symposium is sponsored by the newly formed Mechanics of Soft Materials technical committee in Applied Mechanics Division of ASME.

We are soliciting papers in the area of mechanics of soft materials, which include polymers, elastomers, gels, soft biological tissues, cells, bio-inspired soft materials and soft devices. This multi-session symposium will gather prominent researchers in this emerging area. Researchers are invited to present their recent work in modeling and experimental investigations of large deformation behaviors coupled with multiphysical field (temperature, light, electrical field, magnetic field, chemicals, etc), structure-function relationships, remodeling and degradation, diffusion of the following materials and material systems:

1. Polymers and composites
2. Shape memory polymers and conductive polymers
3. Environmentally responsive gels
4. Dielectric elastomers
5. Liquid crystal elastomers
6. Soft biological tissues, including arteries, skin, eye, and brain, etc.
7. Cells and bio-membranes
8. Bio-inspired soft active materials (Co-sponsored with MD Multifunctional Materials technical committee)
9. Soft devices (Co-sponsored with AMD Integrated Structures technical committee)

To submit an abstract, please

1.      Go to: http://www.asmeconferences.org/congress2010
2.      Select Track 12 (Mechanics of Solids, Structures and Fluids)
3.      Topic area 12-2 (Symposium on Mechanics of Soft Materials)

The deadline for abstract submission is March 1, 2010.

Thanks for your support to the new Mechanics of Soft Materials TC and see you in the beautiful Vancouver in November!!

H. Jerry Qi, Univ. of Colorado, Boulder
Vicky Nguyen, Johns Hopkins University
Wei Hong, Iowa State University
Konstantin Volokh, Israel Institute of Technology
Oscar Lopez-Pamies, SUNY Stony Brook
Hanqing Jiang, Arizona State University
Bo Song, Sandia National Lab
Xuanhe Zhao, Duke University
Teng Li, University of Maryland (representing AMD Integrated Structures TC)

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Call for papers: Symposium on Mechanics of Soft Materials in ASME IMECE 2010