http://www.imechanica.org/node/3713 Comments for "Engineering Mechanics 397: Thin Film Mechanics" en http://www.imechanica.org/node/3713 <p> <strong>Time:</strong> Tuesday and Thursday 2:00 - 3:30 pm </p> <p> <strong>Place:</strong> ECJ 1.214, <a href="http://www.utexas.edu/">University of Texas at Austin</a> </p> <p> <strong>Instructor:</strong> <a href="http://www.ae.utexas.edu/%7Eruihuang/" target="_blank">Rui Huang</a>, WRW 117D, (512) 471-7558, <a href="mailto:ruihuang@mail.utexas.edu">ruihuang@mail.utexas.edu</a> </p> <p> <strong>Lecture notes</strong> (coming soon) </p> <p> <strong>Homewrok sets</strong> (coming soon) </p> <p> <strong>Brief Outline of Topics <br /> </strong> </p> <ul> <li> <p class="MsoNormal"> <strong><span>Introduction to thin film processes</span></strong><span>: deposition methods, growth modes, microstructures</span> </p> </li> <li> <p class="MsoNormal"> <strong><span>Stress in thin films</span></strong><span>: growth stress, epitaxial stress, Stoney formula, wafer curvature</span> </p> </li> <li> <p class="MsoNormal"> <strong><span>Fracture and delamination</span></strong><span>:<strong> </strong>channeling cracks, interface debonding <br /> </span> </p> </li> <li> <p class="MsoNormal"> <strong><span>Film </span></strong><strong><span>buckling</span></strong><span>: buckle-delamination, buckling without delamination (wrinkling), pressurized bulging</span> </p> </li> <li> <p class="MsoNormal"> <strong><span>Plasticity and dislocations</span></strong><span>: strength and hardening, dislocation formation and interactions</span> </p> </li> <li> <p class="MsoNormal"> <strong><span>Creep and mass transport</span></strong><span>: grain-boundary diffusion, interface diffusion, deformation mechanisms, stress-induced voiding, electromigration</span> </p> </li> <li> <p class="MsoNormal"> <strong><span>Morphological evolution</span></strong><span>: chemical potential, surface roughening, self-assembly of quantum dots</span> </p> <p> <strong><br /> </strong></li> </ul> <p> <strong>Auxiliary notes</strong> </p> <ul> <li><a href="http://imechanica.org/node/530">Mechanical Properties of Thin Films</a>, William D. Nix, Stanford University</li> <li><a href="http://imechanica.org/node/903">Fracture Mechanics of Thin Films and Multilayers</a>, John W. Hutchinson, Harvard University</li> <li><a href="http://imechanica.org/node/754">Fracture Mechanics of Thin Films and Composite Materials,</a> J. W. Hutchinson and Z. Suo<a href="http://imechanica.org/node/754"> </a> </li> </ul> <p> <strong>Other references</strong> </p> <ul> <li><em><span>Thin Film Materials: Stress, Defect Formation and Surface Evolution</span></em><span>, by L.B. Freund and S. Suresh. Cambridge University Press, 2003.</span></li> <li><em><span>Materials Science of Thin Films</span></em><span> (2nd ed.), by M. Ohring. Academic Press, 2002.</span></li> <li><span>W.D. Nix, Mechanical properties of thin films. Metall. Trans. 20A, 2217-2245 (1989).</span></li> <li>J. W. Hutchinson and Z. Suo, <a href="http://www.deas.harvard.edu/suo/papers/17.pdf">Mixed-Mode Cracking in Layered Materials</a>. <span>Advances in Applied Mechanics 29, 63-191 (1991).</span></li> <li><span>L.B. Freund, The mechanics of dislocations in strained-layer semiconductor materials. Advances in Applied Mechanics 30, 1-66 (1994).</span></li> <li>Z. Suo,&nbsp;<a href="http://www.deas.harvard.edu/suo/papers/139.pdf"> Reliability of interconnect structures</a>.</li> </ul> <p> <strong>Remarks</strong> </p> <ul> <li>Prerequisite: a graduate course on solid mechanics.</li> <li>No textbook is required. Notes will be posted periodically.</li> </ul> <br class="clear" /> http://www.imechanica.org/node/3713#comments education EM 397 Fall 2008 lecture notes thin film Wed, 20 Aug 2008 13:27:26 -0400 Rui Huang 3713 at http://www.imechanica.org