Frank W. DelRio's blog
Fracture strength of micro- and nano-scale silicon components
Silicon devices are ubiquitous in many micro- and nano-scale technological applications, most notably microelectronics and microelectromechanical systems (MEMS). Despite their widespread usage, however, issues related to uncertain mechanical reliability remain a major factor inhibiting the further advancement of device commercialization. In particular, reliability issues related to the fracture of MEMS components have become increasingly important given continued reductions in critical feature sizes coupled with recent escalations in both MEMS device actuation forces and harsh u
ASME IMECE 2012: Symposium on Quality and Reliability of Electronic/Photonic Packaging, MEMS, and NEMS
Dear Colleagues:
We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX. The symposium is entitled Quality and Reliability of Electronic/Photonic Packaging, MEMS, and NEMS and is part of the Micro- and Nano- Systems Engineering and Packaging Track.
The call-for-papers for the symposium is as follows:
ASME IMECE 2012: Symposium on Tribology of Thin Films and Small-Scale Structures
Dear Colleagues:
We are currently soliciting abstracts for the 2012 ASME IMECE conference on November 9-15, 2012 in Houston, TX. The symposium is entitled Tribology of Thin Films and Small-Scale Structures and is part of the Mechanics of Solids, Structures and Fluids Track.