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Effect of Residual stresses on the Interfacial Fracture Toughness of polymer/Metal Interface

Submitted by shirangi on Fri, 2008-11-14 17:46.

When a bi-material sample for the characterization of interfacial fracture toughness is manufactured, the sample is not usually stress-free at room temperature. If an interface between a metallic substrate and a polymeric adhesive is considered, there are essentially two sources of residual stresses for a dry sample at room temperature:


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EuroSimE 2008 in Freiburg, Germany

Submitted by shirangi on Sun, 2008-03-16 14:35.

 

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 

EuroSimE 2008 Will be held in Konzerthaus, downtown Freiburg, on April 20, 2008 (courses), April 21-22-23 (conference, exhibition).
http://www.eurosime.org/

 program also available:

http://www.eurosime.org/prog.htm


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International conference in Microreliability and Nanoreliability, Berlin, Sep. 2007

Submitted by shirangi on Tue, 2007-08-14 16:59.

1st International CONGRESS on Microreliability and Nanoreliability in Key Technology Applications

Berlin (D), Sept. 2-5, 2007


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Interfacial moisture diffusion using cohesive zone elements

Submitted by shirangi on Wed, 2007-08-08 10:26.

Hello every body,

As most of you know, fracture mechanics of polymer materials needs a special consideration of the viscoelastic material properties. Especially under thermomechanical loading the role of glass transition temperature T_g is very important. That is why people try to characterize the material with different methods including stress relaxation based on Time-Temperature superposition or DMA test.

a similar problem regarding the fracture mechanics of polymers appear when the material is under moisture loading. For example in Electronics Packaging the mold compound of the IC packages absorbs moisture and moisture decreases the interfacial strength between the Mold compound and leadframe.


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