Professor David Barnett of Stanford University will receive the A.C. Eringen Medal from the Society of Engineering Science (SES). The prize is awarded in recognition of sustained outstanding achievements in Engineering Science. Professor Barnett will receive his award during the 49th Annual Technical Meeting of the Society of Engineering Science to be held at Georgia Institute of Technology from October 9-12, 2012.

Professor Markus J. Buehler of MIT will receive the 2012 SES Young Investigator Medal from the Society of Engineering Science (SES).

The Rodney Hill Prize for 2012 is awarded to Professor Huajian Gao of Brown University, USA. 

This prize, which consists of a plaque and a check for $25,000 (twenty-five thousand US Dollars), is to be awarded in recognition of outstanding research in the field of solid mechanics. The prize is to be awarded every 4 years, to coincide with the quadrennial International Congress of Theoretical and Applied Mechanics (ICTAM). The first prize was awarded at ICTAM 2008 in Adelaide.

ScienceWatch.com (affiliated with Thomson-Reuters), has ranked University of Illinois as the most cited institution in engineering from 1999 to 2009 (http://sciencewatch.com/inter/ins/10/10febTOP20ENG/).  It is followed by Berkeley, MIT, Stanford, University of Michigan, and Georgia Tech.
 
For each institution, ScienceWatch.com has also listed a few research directions that have received most citations.  The mechanics work by Professors Yonggang Huang (University of Illinois), Huajian Gao (Brown University), Bill Nix (Stanford) and Hutchinson (Harvard) on Mechanism-based strain (gradient) plasticity leads the list from the University of Illinois.

Abstract submission deadline: March 2, 2009 

PNAS 105, 18675 (2008) 

Science 320, 507 (2008)
Stretchable and Foldable Silicon Integrated Circuits
Dae-Hyeong Kim, Jong-Hyun Ahn, Won Mook Choi, Hoon-Sik Kim, Jizhou Song, Yonggang Huang, Zhuangjian Liu, Chun Lu, and John A. Rogers

Prof. John Rogers' group at UIUC, Prof. Yonggang Huang's group at NWU and IHPC in Singapore just published a paper in Science on stretchable circuits.  In the paper,  we have developed a simple approach to high-performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates.